Electronic package with improved electrical performance
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United States of America Patent
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-
Sep 24, 1996
Issued Date -
N/A
app pub date -
Oct 11, 1995
filing date -
May 17, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic package having improved electrical properties in which a plastic Quad Flat Pack is provided with upper and lower metallic plates encased in the plastic body and overlapping at least a portion of the length of the encased portion of the leads whereby the self and mutual inductance of the package is reduced. A ceramic Quad Flat Pack is provided with metal plates attached to the mating surfaces of the ceramic cover component and the ceramic base component so that at least a portion of the enclosed portion of the leads which are electrically connected to the electronic component inside the components is overlapped on the top and bottom by the metallic plates.
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