Method of forming a device by selectively thermal spraying a metallic conductive material thereon
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United States of America Patent
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Sep 24, 1996
Issued Date -
N/A
app pub date -
Feb 14, 1995
filing date -
Apr 29, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The method disclosed herein begins with a molded housing (13 or 31). In one embodiment (20) the molded housing (13) has a ground shield (14) that is formed by thermally spraying a metallic conductive material onto the housing (13). Electrical connections are then made to link an electronic circuit on a printed circuit board assembly (21) to the ground shield (14). In another embodiment (30), the molded housing (31) has a plurality of elements (such as an indented channel (32), extrusions (33), a slot connector (34), and a notch (35)) that are thermally sprayed in selected areas to form a plurality of connective elements required by the electronic circuit of the printed circuit board assembly.
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