Structure and method for testing wiring segments in an integrated circuit device
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United States of America Patent
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Oct 1, 1996
Grant Date -
N/A
app pub date -
Jul 23, 1992
filing date -
Jul 23, 1992
priority date (Note) -
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Abstract
According to the present invention, means are provided for joining metal wire segments into one or more serpentine structures during the testing phase so that a signal applied at one end will be detected at the other end if the metal segments are continuous. Metal segments connected into one serpentine chain can be simultaneously tested for continuity from a single origin and destination. Preferably two serpentine chains are provided, physically interdigitated with each other so that electrical shorts between adjacent wire segments will cause a signal applied to one serpentine chain to be detected on the other serpentine chain.
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