Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package
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United States of America Patent
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Oct 1, 1996
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N/A
app pub date -
Aug 12, 1994
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Aug 1, 1990
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Abstract
An electrically and thermally conductive rail assembly with impedance control for interconnecting individual level-one integrated circuit packages within a three-dimensional high density integrated circuit package, and methods of manufacturing same.
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