Method of fabricating a laminated substrate assembly chips-first multichip module
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United States of America Patent
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Oct 15, 1996
Grant Date -
N/A
app pub date -
Apr 18, 1995
filing date -
Apr 18, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
A laminated substrate assembly chip first multichip module and a method of making it includes a plurality of electronic components thinned to a predetermined thickness and mounting them on a fiat substrate in a precise position and orientation; a mechanical spacer layer including a cured film and an adhesive bonded to the flat surface of the substrate surrounding the components; the mechanical spacer layer having a thickness approximately equal to the predetermined thickness of the components and a pattern of holes in it corresponding with the precise position and orientation of the components mounted on the substrate; and a cover layer bonded over the mechanical layer and the tops of the components.
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