Laser ablation forward metal deposition with electrostatic assisted bonding
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United States of America Patent
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Oct 22, 1996
Issued Date -
N/A
app pub date -
Mar 31, 1995
filing date -
Oct 24, 1994
priority date (Note) -
Expired
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Abstract
Apparatus and method for metal line deposition on a substrate. Laser ablation of a metal film coated on a first substrate removes metal ions from the film. The ions travel forward to a surface of a second substrate disposed opposite the metal film on the first substrate and are deposited on the second substrate. A positive electrode on the first substrate, a negative electrode on the second substrate, and a power supply create an electric field that is simultaneously applied across the first and second substrates to bond the metal ions to the second substrate. Bonding is enhanced by repeated reflecting a laser beam through the second substrate to heat the second substrate. The laser beam is reflected between a reflector and the deposited metal line.
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