Conductive paint having good adhesion to molding of metallic oxide

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United States of America Patent

PATENT NO 5567357
SERIAL NO

08424427

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A conductive paint having a good adhesion to a molding of metallic oxide comprises: 100 parts by weight of silver-plated copper powder containing silver plating in the amount of not more than 30 wt %; 13.6-6.0 parts by weight of phenolic resin (solid content); 0.2-0.7 part by weight of one selected from saturated fatty acids, unsaturated fatty acids, metallic salts thereof, and coupling agents containing saturated fatty acids or unsaturated fatty acids; 1.0-4.0 parts by weight of triethanolamine; and 0.1-1.0 part by weight of dihydroxybenzene. The phenolic resin is a resol phenolic resin having an infrared spectrum that satisfies the following relationships: (A) 1/n=0.8-1.2 (B) m/n=0.8-1.2 (C) b/a=0.8-1.2 (D) c/a=1.2-1.5 wherein 1, m, n, a, b and c are, respectively, infrared transmittances of 2-monosubstitution product, 2,4-disubstitution product, 2,4,6-trisubstitution product, methylol group, dimethylenether, and phenol group.

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Patent Owner(s)

  • TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wakita, Shinichi Osaka, JP 12 229

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