Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
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United States of America Patent
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Oct 22, 1996
Grant Date -
N/A
app pub date -
Sep 28, 1994
filing date -
Sep 28, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A fabrication method and resultant monolithic electronic module having a separately formed thin-film layer attached to a side surface. The fabrication method includes providing an electronic module composed of stacked integrated circuit chips. A thin-film layer is separately formed on a temporary support which is used to attach the thin-film layer to the electronic module. The disclosed techniques may also be used for attaching an interposer, which may include active circuity, to an electronic module. Specific details of the fabrication method, resulting multichip packages, and various thin-film structures are set forth.
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