Importance

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Abstract

A technique for reducing thermally-induced mechanical stresses on bond pads in semiconductor device assemblies is accomplished by grouping (laying out) the bond pads in two parallel rows, approximately centered about a central axis of the die. Further, the bond pads of one row are axially offset from the bond pads of the other row, thereby forming a two-row zig-zag linear configuration of bond pads. The 'axis' is a line preferably passing through a thermal centroid of the die. By keeping the bond pad layout close to the axis, lateral thermally-induced displacements of the bond pads relative to the axis can be minimized and controlled. Longitudinal (axial) displacements of the bond pads are accommodated by flexing, rather than compression, of conductive lines (such as leadframe fingers) connecting to the bond pads and entering the die perpendicular to the axis. By providing a staggered double-row configuration, a larger number of bond pads may be accommodated than could be accommodated in a single row, linear configuration of bond pads.

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First Claim