Mechanism and method for mechanically removing a substrate

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United States of America Patent

PATENT NO 5569350
SERIAL NO

08389789

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A mechanism for completely separating a substrate, such as a semiconductor substrate, from at base in such a way that the substrate is in a horizontal position and can be easily removed from an electrostatic chuck. The substrate is mounted on a pedestal which is placed on a base such as an electrode. Pins are mounted within the base beneath a central portion of the substrate. The pins can be moved vertically through the circular pedestal to lift the substrate from the pedestal. A ring is mounted around the pedestal and underneath the outer edge of the substrate. When the pins are protrude beyond the top surface of the circular pedestal the substrate is lifted and caused to tilt. The ring then is lifted to act on the outer edge of the rear surface of the substrate, thus separating the substrate from the circular pedestal and returning the substrate to a horizontal position.

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Patent Owner(s)

Patent OwnerAddress
ANELVA CORPORATION8-1 YOTSUYA 5-CHOME FUCHU-SHI TOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Osada, Tomoaki Tokyo, JP 34 538
Shirai, Yasuyuki Tokyo, JP 65 1037

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