Adhesive for printed circuit board
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United States of America Patent
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-
Nov 5, 1996
Grant Date -
N/A
app pub date -
Nov 14, 1994
filing date -
Nov 26, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An adhesive for a printed circuit board which consists essentially of a dispersion of a resin which is soluble in an alkaline oxidizing agent after curing in a resin matrix which is sparingly soluble in an alkaline oxidizing agent after curing, and a process for producing a printed circuit board using the above adhesive.
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Cited Art Landscape
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