Conductive epoxy grid array semiconductor packages
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United States of America Patent
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-
Nov 5, 1996
Issued Date -
N/A
app pub date -
Apr 27, 1995
filing date -
Sep 15, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device assembly utilizing a grid array of conductive epoxy for connecting it to an electronic system. Conductive epoxy is screen printed in a desired pattern onto a printed wire board of the semiconductor device assembly. The conductive epoxy is B-staged by heating in an oven. The semiconductor device assembly is then placed onto a system printed circuit board wherein the B-staged conductive epoxy is further cured by heat and effectively makes mechanical and electrical connections between the semiconductor device assembly and the system printed circuit board.
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