Copper-based metal polishing solution and method for manufacturing semiconductor device
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United States of America Patent
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Nov 19, 1996
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N/A
app pub date -
Dec 9, 1994
filing date -
Dec 14, 1993
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Abstract
Disclosed is a copper-based metal polishing solution which hardly dissolves a Cu film or a Cu alloy film when the film is dipped into the solution, and has a dissolution velocity during polishing several times higher than that during dipping. This copper-based metal polishing solution contains at least one organic acid selected from aminoacetic acid and amidosulfuric acid, an oxidizer, and water.
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