Method of metallizing high aspect ratio apertures
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United States of America Patent
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Nov 19, 1996
Grant Date -
N/A
app pub date -
Apr 22, 1996
filing date -
Apr 22, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing high aspect ratio plated through holes in a circuit carrying substrate. High aspect ratio apertures or holes (16) are formed in a substrate (10). A thin film of copper (20) is sputtered onto the substrate and in the apertures that a macroscopically discontinuous copper film (26) is formed on part of the aperture walls. The macroscopically discontinuous copper film is substantially thinner than the copper film that is deposited on the surface. A catalytic copper coating (30) is plated directly on the vacuum deposited thin film of copper by electroless copper plating in a manner sufficient to form a macroscopically continuous copper layer on the aperture walls.
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