Recording head with through-hole wiring connection which is disposed within the liquid chamber
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United States of America Patent
Stats
-
Nov 19, 1996
Issued Date -
N/A
app pub date -
May 20, 1993
filing date -
Feb 26, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A recording device includes a substrate having both an ink discharge portion with openings for discharging ink and a liquid chamber for holding the ink for supply to the openings, and a wiring portion transmits signals to electro-thermal converting elements. The wiring portion includes several electroconductive layers, an interlayer insulating layer made of first and second insulating layers, and a protective layer. Some of the layers have through holes, and the through holes are disposed within the liquid chamber. Different electroconductive layers are electrically connected via a through hole formed in the interlayer insulating layer. The through hole size varies so that the hole in a second electroconductive layer is larger than the through hole in a first electroconductive layer.
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