Components for housing an integrated circuit device
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United States of America Patent
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-
Nov 26, 1996
Grant Date -
N/A
app pub date -
Mar 29, 1994
filing date -
Mar 29, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.
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