Coating apparatus and method
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United States of America Patent
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Dec 3, 1996
Issued Date -
N/A
app pub date -
Jan 26, 1994
filing date -
Jul 26, 1991
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A coating apparatus comprises a chuck on which a semiconductor wafer is adhered, a resist liquid supplying system for supplying a resist liquid to the semiconductor wafer, a motor for rotating the semiconductor wafer, thereby spreading the resist liquid over the semiconductor wafer, and a plate, on which the semiconductor wafer is placed, for creating a temperature distribution on the semiconductor wafer.
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