US Patent No: 5,580,831
Number of patents in Portfolio can not be more than 2000
Sawcut method of forming alignment marks on two faces of a substrate
Stats
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Dec 3, 1996
Issued date -
Jul 28, 1993
filing date -
08/098,579
serial no -
In Force
status
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Abstract
The present invention is a method for producing alignment marks on opposite faces of a generally flat substrate such as a semiconductor wafer. First, reference cuts are produced at the edges of the substrate at four points around the wafer. Next, the center line is determined on the first face of the substrate between two oppositely disposed reference cuts. First and second grooves are then cut in the first face of the substrate a first predetermined distance from the first center line. Third and fourth grooves are cut in the first face perpendicular to and through the first and second grooves at the first predetermined distance from the second reference cut forming crosshair alignment patterns. Next, the center line is determined on the second face of the substrate between the third and fourth reference cuts, and fifth and sixth grooves are cut in the second face of the substrate a second predetermined distance from the second center line. Finally, seventh and eighth grooves are cut in the second face of the substrate perpendicular to and through the fifth and sixth grooves at the second predetermined distance from the second reference cut. Thus, pairs of crosshairs are located on opposite faces of the substrate based upon reference cuts easily locatable from either side. In a preferred embodiment, the first and second predetermined distances are different from one another, to allow the cuts on opposite faces to be offset to prevent mechanical failure.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 4,814,296 Method of fabricating image sensor dies for use in assembling arrays | 54 | 1987 | |
| 4,822,755 Method of fabricating large area semiconductor arrays | 45 | 1988 | |
| 5,128,282 Process for separating image sensor dies and the like from a wafer that minimizes silicon waste | 42 | 1991 | |
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| 4,534,804 Laser process for forming identically positioned alignment marks on the opposite sides of a semiconductor wafer | 31 | 1984 | |
| 5,284,792 Full-wafer processing of laser diodes with cleaved facets | 20 | 1993 | |
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| 5,196,378 Method of fabricating an integrated circuit having active regions near a die edge | 25 | 1991 | |
| 5,393,706 Integrated partial sawing process | 26 | 1993 | |
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| 5,174,188 Process and device for marking and cleaving plaquettes of monocrystalline semiconductor materials | 12 | 1990 | |
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| 4,914,829 Image alignment indicators | 3 | 1988 | |
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| 5,279,992 Method of producing a wafer having a curved notch | 7 | 1992 | |
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| 4,900,283 Method for arranging chips each having an array of semiconductor light emitting elements | 11 | 1987 | |
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| 5,182,233 Compound semiconductor pellet, and method for dicing compound semiconductor wafer | 25 | 1991 | |
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| 5,302,554 Method for producing semiconductor device | 22 | 1992 | |
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| 4,371,598 Method for fabricating aligned patterns on the opposed surfaces of a transparent substrate | 7 | 1981 | |
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| 4,423,959 Positioning apparatus | 32 | 1983 | |
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| 4,356,223 Semiconductor device having a registration mark for use in an exposure technique for micro-fine working | 24 | 1981 | |
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| 5,128,280 Fabrication process for wafer alignment marks by using peripheral etching to form grooves | 17 | 1991 | |
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| 4,547,446 Motion measurement and alignment method and apparatus | 12 | 1983 | |
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| 4,937,162 Method of obtaining relatively aligned patterns on two opposite surfaces of an opaque slice | 5 | 1988 | |