Stack of IC chips in lieu of single IC chip

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5581498
SERIAL NO

08326645

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic package is disclosed in which a plurality of stacked 'same function' IC chips are designed to be used in lieu of a single IC chip, and to fit into a host computer system, in such a way that the system is 'unaware' that substitution has been made. Memory packages are of primary interest, but other packages are also feasible, such as packages of FPGA chips. In order to 'translate' signals between the host system and the stacked IC chips, it is necessary to include suitable interface circuitry between the host system and the stacked chips. Specific examples are disclosed of a 4 MEG SRAM package containing 4 stacked IC chips each supplying a 1 MEG memory, and of 64 MEG DRAM packages containing 4 stacked IC chips each supplying a 16 MEG memory. The interface circuitry can be provided by a single special purpose IC chip included in the stack, referred to as a VIC chip, which chip provides both buffering and decoding circuitry. Additionally, the VIC chip should provide power supply buffering. And, if it has sufficient real estate, such performance enhancing functions as error correction, memory cache, and synchronized memory may be included in the VIC chip circuitry.

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Patent Owner(s)

Patent OwnerAddress
TALON RESEARCH LLC4455 CAMP BOWIE BOULEVARD #74 FORT WORTH TX 76107

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ludwig, David E Irvine, CA 3 411
Saunders, Christ H Laguna Niguel, CA 5 620
Some, Raphael R Williston, VT 3 740
Stuart, John J Newport Beach, CA 2 404

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