Method for improved pre-metal planarization

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5585308
SERIAL NO

08411585

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method of forming an integrated circuit wherein a planarization step is been performed before the primary metal deposition step, but after deposition of the adhesion and barrier layers. Thus the adhesion and barrier layers are present on the sidewalls of contact holes, but do not underlie the whole extent of the primary metallization.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
SGS-THOMSON MICROELECTRONICS, INC.CARROLLTON, TX550

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sardella, John C Highland Village, TX 12 188

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTEL CORPORATION (1)
* 5164330 Etchback process for tungsten utilizing a NF3/AR chemistry 81 1991
 
MICRON TECHNOLOGY, INC. (1)
* 5124780 Conductive contact plug and a method of forming a conductive contact plug in an integrated circuit using laser planarization 90 1991
 
KAWASAKI MICROELECTRONICS, INC. (1)
* 5486492 Method of forming multilayered wiring structure in semiconductor device 78 1993
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 5049975 Multi-layered interconnection structure for a semiconductor device 117 1990
 
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (1)
* 5356836 Aluminum plug process 52 1993
 
Crosspoint Solutions, Inc. (1)
* 5233217 Plug contact with antifuse 121 1991
 
HITACHI MICROPUTER ENGINEERING LTD. (1)
* 5061985 Semiconductor integrated circuit device and process for producing the same 103 1989
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
ROUND ROCK RESEARCH, LLC (7)
7683458 Through-wafer interconnects for photoimager and memory wafers 19 2007
* 2008/0111,213 THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS 30 2007
7956443 Through-wafer interconnects for photoimager and memory wafers 5 2010
* 2010/0171,217 THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS 1 2010
8502353 Through-wafer interconnects for photoimager and memory wafers 1 2011
* 2011/0233,777 THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS 3 2011
8669179 Through-wafer interconnects for photoimager and memory wafers 0 2013
 
LUCENT TECHNOLOGIES INC. (1)
* 6028359 Integrated circuit having amorphous silicide layer in contacts and vias and method of manufacture therefor 23 1998
 
MONTEREY RESEARCH, LLC (1)
* 6251717 Viable memory cell formed using rapid thermal annealing 6 1998
 
VLSI TECHNOLOGY, INC. (1)
* 5804502 Tungsten plugs for integrated circuits and methods for making same 3 1997
 
MICRON TECHNOLOGY, INC. (55)
* 5658829 Semiconductor processing method of forming an electrically conductive contact plug 21 1995
* 5933754 Semiconductor processing method of forming an electrically conductive contact plug 6 1997
* 6025271 Method of removing surface defects or other recesses during the formation of a semiconductor device 8 1997
6245671 Semiconductor processing method of forming an electrically conductive contact plug 2 1999
6462394 Device configured to avoid threshold voltage shift in a dielectric film 2 1999
6228772 Method of removing surface defects or other recesses during the formation of a semiconductor device 1 2000
7067442 Method to avoid threshold voltage shift in thicker dielectric films 2 2000
6355566 Method of removing surface defects or other recesses during the formation of a semiconductor device 2 2001
8084866 Microelectronic devices and methods for filling vias in microelectronic devices 10 2003
* 7268413 Bipolar transistors with low-resistance emitter contacts 2 2004
* 2005/0023,707 Bipolar transistors with low-resistance emitter contacts 1 2004
7795134 Conductive interconnect structures and formation methods using supercritical fluids 6 2005
7863187 Microfeature workpieces and methods for forming interconnects in microfeature workpieces 10 2005
7622377 Microfeature workpiece substrates having through-substrate vias, and associated methods of formation 11 2005
* 2007/0045,120 Methods and apparatus for filling features in microfeature workpieces 39 2005
* 2007/0049,016 Microfeature workpieces and methods for forming interconnects in microfeature workpieces 61 2005
* 2007/0045,826 Microfeature workpiece substrates having through-substrate vias, and associated methods of formation 49 2005
8202806 Method to avoid threshold voltage shift in thicker dielectric films 1 2005
8536485 Systems and methods for forming apertures in microfeature workpieces 1 2006
8664562 Systems and methods for forming apertures in microfeature workpieces 0 2006
7589008 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods 14 2006
7759800 Microelectronics devices, having vias, and packaged microelectronic devices having vias 24 2006
7749899 Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces 6 2006
* 2007/0281,473 Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces 42 2006
7435913 Slanted vias for electrical circuits on circuit boards and other substrates 3 2006
* 2006/0240,687 Slanted vias for electrical circuits on circuit boards and other substrates 6 2006
7629249 Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods 17 2006
7902643 Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods 37 2006
* 2008/0054,444 Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods 61 2006
7915736 Microfeature workpieces and methods for forming interconnects in microfeature workpieces 4 2007
* 2007/0267,754 MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MICROFEATURE WORKPIECES 12 2007
7830018 Partitioned through-layer via and associated systems and methods 6 2007
* 2009/0057,912 PARTITIONED THROUGH-LAYER VIA AND ASSOCIATED SYSTEMS AND METHODS 42 2007
7884015 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods 9 2007
7531453 Microelectronic devices and methods for forming interconnects in microelectronic devices 33 2008
8322031 Method of manufacturing an interposer 0 2008
9214391 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods 0 2008
* 2009/0008,780 METHODS FOR FORMING INTERCONNECTS IN MICROELECTRONIC WORKPIECES AND MICROELECTRONIC WORKPIECES FORMED USING SUCH METHODS 4 2008
7829976 Microelectronic devices and methods for forming interconnects in microelectronic devices 23 2009
7973411 Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods 4 2009
8008192 Conductive interconnect structures and formation methods using supercritical fluids 28 2010
8367538 Partitioned through-layer via and associated systems and methods 1 2010
* 2011/0019,372 PARTITIONED THROUGH-LAYER VIA AND ASSOCIATED SYSTEMS AND METHODS 1 2010
* 2011/0079,900 MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MICROFEATURE WORKPIECES 1 2010
8247907 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods 1 2011
* 2011/0133,302 METHODS FOR FORMING INTERCONNECTS IN MICROELECTRONIC WORKPIECES AND MICROELECTRONIC WORKPIECES FORMED USING SUCH METHODS 3 2011
9099539 Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods 0 2011
8610279 Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods 0 2011
9293367 Conductive interconnect structures and formation methods using supercritical fluids 0 2011
8748311 Microelectronic devices and methods for filing vias in microelectronic devices 0 2011
9281241 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods 0 2012
8536046 Partitioned through-layer via and associated systems and methods 0 2013
8686313 System and methods for forming apertures in microfeature workpieces 0 2013
9452492 Systems and methods for forming apertures in microfeature workpieces 0 2014
9570350 Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods 0 2015
 
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (1)
* 5994213 Aluminum plug process 2 1998
 
APPLIED MATERIALS, INC. (14)
* 6066358 Blanket-selective chemical vapor deposition using an ultra-thin nucleation layer 30 1996
* 6077781 Single step process for blanket-selective CVD aluminum deposition 8 1996
* 6001420 Semi-selective chemical vapor deposition 56 1996
* 6110828 In-situ capped aluminum plug (CAP) process using selective CVD AL for integrated plug/interconnect metallization 26 1996
* 6139905 Integrated CVD/PVD Al planarization using ultra-thin nucleation layers 8 1997
* 5877086 Metal planarization using a CVD wetting film 33 1997
6355560 Low temperature integrated metallization process and apparatus 6 1998
6726776 Low temperature integrated metallization process and apparatus 4 1999
6430458 Semi-selective chemical vapor deposition 8 1999
6207558 Barrier applications for aluminum planarization 42 1999
6458684 Single step process for blanket-selective CVD aluminum deposition 33 2000
* 6368880 Barrier applications for aluminum planarization 13 2001
6743714 Low temperature integrated metallization process and apparatus 1 2002
6797620 Method and apparatus for improved electroplating fill of an aperture 4 2002
 
GLOBALFOUNDRIES INC. (2)
* 6140234 Method to selectively fill recesses with conductive metal 199 1998
7456501 Semiconductor structure having recess with conductive metal 0 2000
 
TEXAS INSTRUMENTS INCORPORATED (1)
* 2007/0184,666 Method for removing residue containing an embedded metal 1 2006
 
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION (1)
* 6458706 Method of forming contact using non-conformal dielectric liner 2 2000
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
* 5858873 Integrated circuit having amorphous silicide layer in contacts and vias and method of manufacture thereof 33 1997
* Cited By Examiner