Heat treatment apparatus and heat treatment boat
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United States of America Patent
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-
Dec 24, 1996
Issued Date -
N/A
app pub date -
May 30, 1995
filing date -
Jan 27, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
A heat treatment boat houses a plurality of semiconductor wafers in a manner separated at intervals for heat-treating the wafers in a heat treatment furnace. The heat treatment boat includes a bottom plate, a first support rod erected on the outer peripheral edge of the bottom plate, a second support rod and a third support rod both erected on the bottom plate so as to make an central angle of 105.degree. to 120.degree. with the first support rod with respect to the center of the respective wafer supported by the rods, and a top plate provided opposed to the bottom plate for holding the rods. The stresses applied to the wafers housed in the heat treatment boat are distributed equivalently to three contacting points with the rods and become the minimum.
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