Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
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United States of America Patent
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Dec 31, 1996
Issued Date -
N/A
app pub date -
Sep 5, 1995
filing date -
Jan 24, 1995
priority date (Note) -
Expired
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Abstract
The present invention includes a high density integrated circuit module which includes a plurality of stacked, individual integrated circuit devices wherein serpentine electrical interconnect rails connect electrical leads extending from the individual integrated circuit devices within the module.
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