Multilayer through type capacitor array
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United States of America Patent
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-
Dec 31, 1996
Grant Date -
N/A
app pub date -
Dec 14, 1994
filing date -
Dec 16, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention decreases crosstalk due to capacitive coupling between through type capacitor elements in a multilayer through type capacitor array. On dielectric sheets between electrodes, which constitute a multi capacitor array, through-holes filled with conductive materials are formed, where a central conductor is not present. By electrically connecting conductive materials filled in the through-holes, electrostatic shielding is provided between the through type capacitor elements. Electrical connection is achieved through conductive layers formed outside or inside the through type capacitor elements.
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