UV light sensitive die-pac for securing semiconductor dies during transport
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United States of America Patent
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Jan 7, 1997
Grant Date -
N/A
app pub date -
Jan 4, 1995
filing date -
Jan 4, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A structure for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die atop an ultra-violet (UV) light penetratable plate using a UV light sensitive adhesive layer. Once the structure reaches its destination, prior to removal of the die, the adhesive layer is exposed to ultraviolet light. This exposure reduces the adhesiveness or coefficient of friction of the layer, thereby facilitating die removal from the structure. The UV sensitive adhesive does not leave contaminating silicon residue on the removed die. The invention may be realized using currently commercially available UV tape and a modified die-pac having a UV light penetratable window.
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