Thermally conductive adhesive interface
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United States of America Patent
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-
Jan 7, 1997
Issued Date -
N/A
app pub date -
Jul 25, 1995
filing date -
Feb 14, 1994
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A thermally conductive interface is provided suitable for thermal conduction, especially between electronic components. The preferred thermally conductive interface comprises an open structure fluoropolymer material, such as expanded polytetrafluoroethylene, with uncoated thermally conductive particles attached to solid portions thereof. The interface has numerous benefits over previously available material, such as improved thermal conductivity, high conformability, better compressibility, inherent porosity so as to provide air relief, improved stress relief, and high material compliance and resistance to fatigue during thermal cycling.
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