Glass bubbles for use as fillers in printed circuit board
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United States of America Patent
Stats
-
Jan 7, 1997
Grant Date -
N/A
app pub date -
Oct 3, 1994
filing date -
Oct 3, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Glass bubbles for use as fillers in a plastic resin substrate of an electrical printed circuit board are light in weight, low in density, and small in alkali amount leached sufficiently to insure electrical insulation resistance of the substrate, and consist essentially of, by weight, SiO.sub.2 40.0-60.0%, Al.sub.2 O.sub.3 5.0-22.0%, B.sub.2 O.sub.3 1.0-15.0%, CaO 10.0-30.0%, BaO 0-15.0%, MgO 0-10.0%, ZnO 0-10.0%, SrO 0-10.0%, Na.sub.2 O+K.sub.2 O+Li.sub.2 O 0-1.9%, As.sub.2 O.sub.3 +Sb.sub.2 O.sub.3 0-1.54, V.sub.2 O.sub.5 0-10.0%, TiO.sub.2 0-10.0%, and SO.sub.3 0.05-1.7%.
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