Adhesive resin composition
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United States of America Patent
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Jan 7, 1997
Grant Date -
N/A
app pub date -
Jan 10, 1995
filing date -
Jan 25, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention relates to an adhesive resin composition comprising an ethylene polymer having a melting point of 70 to 132.degree. C., a density of 0.88 to 0.94% g/cm.sup.3 and a melt flow rate (MFR) of 0.05 to 50 g/10 min. and/or a modified product thereof with an unsaturated carboxylic acid or its derivative (component A); a tackifier (component B); and a block copolymer containing at least one polymer block mainly composed of a vinyl aromatic hydrocarbon and at least one polymer block mainly composed of a conjugated diene or a hydrogenated product thereof (component C). This composition is useful as an adhesives showing excellent adhesion over a wide temperature range as well as processability by film molding, sheet molding, blow molding, etc. It is available for laminates comprising various kinds of resins such as polyolefins, styrenic resins, polyesters, acrylic resins and polyamides.
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