US Patent No: 5,592,019

Number of patents in Portfolio can not be more than 2000

Semiconductor device and module

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Abstract

A semiconductor device in a vertical surface mount package, reduced in size and having a higher heat radiating capacity, a method of producing the semiconductor device, and a semiconductor module. Leads of a first lead frame and leads of a second lead frame are parallel to each other and at least a portion of the leads overlap leads of the other lead frame when geometrically projected on them. An inner lead may extend out from the semiconductor package or the back side of a die pad in the semiconductor package may be exposed. The invention allows more outer leads to be used and makes it possible to reduce the size of the semiconductor device and to achieve high density mounting.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MITSUBISHI DENKI KABUSHIKI KAISHATOKYO19933

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichiyama, Hideyuki Kikuchi-gun, JP 10 633
Ono, Kisamitsu Kikuchi-gun, JP 2 409
Shimomura, Kou Kikuchi-gun, JP 4 242
Ueda, Tetsuya Kasugai, JP 114 1426

Cited Art

Patent Info (Count) # Cites Year
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,172,214 Leadless semiconductor device and method for making the same 282 1992
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
6,366,959 Method and apparatus for real time communication system buffer size and error correction coding selection 42 1999
 
HITACHI, LTD. (1)
5,047,837 Semiconductor device with heat transfer cap 14 1989
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
4,796,078 Peripheral/area wire bonding technique 141 1987
 
KABUSHIKI KAISHA TOSHIBA (1)
5,365,106 Resin mold semiconductor device 152 1993
 
KNOX MANUFACTURING CO. (1)
4,206,559 Supporting leg assembly for an illuminated transparency viewer 4 1978
 
SUN MICROSYSTEMS, INC. (1)
6,366,954 Method and data format for exchanging data between a Java system database entry and an LDAP directory service 28 1999
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (2)
4,237,154 Improved galvanizing method [and apparatus] 5 1979
5,152,495 Umbrella anchoring mechanism 44 1991

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
AMKOR TECHNOLOGY, INC. (113)
6,825,062 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 9 2002
6,777,789 Mounting for a package containing a chip 6 2003
6,833,609 Integrated circuit device packages and substrates for making the packages 7 2003
6,965,159 Reinforced lead-frame assembly for interconnecting circuits within a circuit module 4 2003
6,750,545 Semiconductor package capable of die stacking 13 2003
6,927,483 Semiconductor package exhibiting efficient lead placement 23 2003
6,794,740 Leadframe package for semiconductor devices 4 2003
7,095,103 Leadframe based memory card 0 2003
6,879,034 Semiconductor package including low temperature co-fired ceramic substrate 4 2003
7,045,396 Stackable semiconductor package and method for manufacturing same 77 2003
7,008,825 Leadframe strip having enhanced testability 22 2003
6,876,068 Semiconductor package with increased number of input and output pins 44 2003
6,897,550 Fully-molded leadframe stand-off feature 3 2003
7,485,952 Drop resistant bumpers for fully molded memory cards 0 2003
6,873,041 Power semiconductor package with strap 16 2003
7,071,541 Plastic integrated circuit package and method and leadframe for making the package 1 2003
7,245,007 Exposed lead interposer leadframe package 43 2003
7,057,280 Leadframe having lead locks to secure leads to encapsulant 4 2003
6,998,702 Front edge chamfer feature for fully-molded memory cards 7 2003
6,846,704 Semiconductor package and method for manufacturing the same 10 2003
6,967,395 Mounting for a package containing a chip 12 2003
6,893,900 Method of making an integrated circuit package 1 2003
7,138,707 Semiconductor package including leads and conductive posts for providing increased functionality 5 2003
7,144,517 Manufacturing method for leadframe and for semiconductor package using the leadframe 3 2003
7,211,879 Semiconductor package with chamfered corners and method of manufacturing the same 4 2003
6,965,157 Semiconductor package with exposed die pad and body-locking leadframe 9 2003
7,115,445 Semiconductor package having reduced thickness 1 2004
7,057,268 Cavity case with clip/plug for use on multi-media card 3 2004
7,091,594 Leadframe type semiconductor package having reduced inductance and its manufacturing method 7 2004
7,170,150 Lead frame for semiconductor package 2 2004
6,844,615 Leadframe package for semiconductor devices 7 2004
7,005,326 Method of making an integrated circuit package 5 2004
7,190,062 Embedded leadframe semiconductor package 24 2004
7,067,908 Semiconductor package having improved adhesiveness and ground bonding 4 2004
7,211,471 Exposed lead QFP package fabricated through the use of a partial saw process 42 2004
7,598,598 Offset etched corner leads for semiconductor package 0 2004
7,202,554 Semiconductor package and its manufacturing method 14 2004
7,045,882 Semiconductor package including flip chip 7 2004
6,953,988 Semiconductor package 18 2004
7,217,991 Fan-in leadframe semiconductor package 7 2004
7,253,503 Integrated circuit device packages and substrates for making the packages 41 2004
7,001,799 Method of making a leadframe for semiconductor devices 2 2004
7,064,009 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 7 2004
7,030,474 Plastic integrated circuit package and method and leadframe for making the package 2 2004
7,176,062 Lead-frame method and assembly for interconnecting circuits within a circuit module 0 2005
7,214,326 Increased capacity leadframe and semiconductor package using the same 4 2005
7,247,523 Two-sided wafer escape package 15 2005
6,995,459 Semiconductor package with increased number of input and output pins 49 2005
7,192,807 Wafer level package and fabrication method 17 2005
7,045,883 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 5 2005
7,507,603 Etch singulated semiconductor package 8 2005
7,361,533 Stacked embedded leadframe 20 2005
7,572,681 Embedded electronic component package 19 2005
7,112,474 Method of making an integrated circuit package 1 2005
7,564,122 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 1 2006
8,410,585 Leadframe and semiconductor package made using the leadframe 0 2006
7,535,085 Semiconductor package having improved adhesiveness and ground bonding 2 2006
7,902,660 Substrate for semiconductor device and manufacturing method thereof 15 2006
7,968,998 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 2 2006
7,321,162 Semiconductor package having reduced thickness 0 2006
7,332,375 Method of making an integrated circuit package 0 2006
7,521,294 Lead frame for semiconductor package 5 2006
7,714,431 Electronic component package comprising fan-out and fan-in traces 20 2006
7,687,893 Semiconductor package having leadframe with exposed anchor pads 3 2006
7,829,990 Stackable semiconductor package including laminate interposer 1 2007
7,982,297 Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same 1 2007
7,420,272 Two-sided wafer escape package 16 2007
7,723,210 Direct-write wafer level chip scale package 6 2007
7,977,774 Fusion quad flat semiconductor package 3 2007
7,687,899 Dual laminate package structure with embedded elements 5 2007
7,777,351 Thin stacked interposer package 23 2007
8,089,159 Semiconductor package with increased I/O density and method of making the same 0 2007
7,847,386 Reduced size stacked semiconductor package and method of making the same 0 2007
7,560,804 Integrated circuit package and method of making the same 1 2008
7,956,453 Semiconductor package with patterning layer and method of making same 0 2008
7,723,852 Stacked semiconductor package and method of making same 4 2008
8,067,821 Flat semiconductor package with half package molding 2 2008
7,768,135 Semiconductor package with fast power-up cycle and method of making same 3 2008
7,808,084 Semiconductor package with half-etched locking features 1 2008
8,125,064 Increased I/O semiconductor package and method of making same 0 2008
8,184,453 Increased capacity semiconductor package 1 2008
7,692,286 Two-sided fan-out wafer escape package 20 2008
7,847,392 Semiconductor device including leadframe with increased I/O 5 2008
7,989,933 Increased I/O leadframe and semiconductor device including same 1 2008
8,008,758 Semiconductor device with increased I/O leadframe 3 2008
8,089,145 Semiconductor device including increased capacity leadframe 1 2008
8,072,050 Semiconductor device with increased I/O leadframe including passive device 0 2008
7,875,963 Semiconductor device including leadframe having power bars and increased I/O 3 2008
7,982,298 Package in package semiconductor device 1 2008
8,058,715 Package in package device for RF transceiver module 1 2009
7,732,899 Etch singulated semiconductor package 0 2009
8,026,589 Reduced profile stackable semiconductor package 4 2009
7,960,818 Conformal shield on punch QFN semiconductor package 0 2009
7,928,542 Lead frame for semiconductor package 1 2009
7,977,163 Embedded electronic component package fabrication method 2 2009
8,089,141 Semiconductor package having leadframe with exposed anchor pads 0 2010
8,188,584 Direct-write wafer level chip scale package 0 2010
7,932,595 Electronic component package comprising fan-out traces 4 2010
8,324,511 Through via nub reveal method and structure 0 2010
7,906,855 Stacked semiconductor package and method of making same 1 2010
8,294,276 Semiconductor device and fabricating method thereof 0 2010
8,084,868 Semiconductor package with fast power-up cycle and method of making same 0 2010
8,319,338 Thin stacked interposer package 0 2010
8,299,602 Semiconductor device including leadframe with increased I/O 0 2010
8,188,579 Semiconductor device including leadframe having power bars and increased I/O 1 2010
8,390,130 Through via recessed reveal structure and method 0 2011
8,318,287 Integrated circuit package and method of making the same 0 2011
8,102,037 Leadframe for semiconductor package 0 2011
8,119,455 Wafer level package fabrication method 1 2011
8,304,866 Fusion quad flat semiconductor package 0 2011
8,432,023 Increased I/O leadframe and semiconductor device including same 0 2011
8,227,921 Semiconductor package with increased I/O density and method of making same 0 2011
8,298,866 Wafer level package and fabrication method 0 2012
 
MICRON TECHNOLOGY, INC. (82)
6,235,551 Semiconductor device including edge bond pads and methods 16 1997
5,995,378 Semiconductor device socket, assembly and methods 32 1997
5,940,277 Semiconductor device including combed bond pad opening, assemblies and methods 40 1997
6,147,411 Vertical surface mount package utilizing a back-to-back semiconductor device module 20 1998
6,089,920 Modular die sockets with flexible interconnects for packaging bare semiconductor die 99 1998
6,124,150 Transverse hybrid LOC package 8 1998
6,153,929 Low profile multi-IC package connector 22 1998
6,326,687 IC package with dual heat spreaders 93 1998
6,261,865 Multi chip semiconductor package and method of construction 104 1998
6,088,237 Semiconductor device socket, assembly and methods 25 1998
6,419,517 Apparatus and method for packaging circuits 1 1999
6,091,606 Semiconductor device including combed bond pad opening, assemblies and methods 14 1999
6,277,673 Leads under chip in conventional IC package 9 1999
6,271,580 Leads under chip in conventional IC package 65 1999
6,150,710 Transverse hybrid LOC package 47 1999
6,088,238 Semiconductor device socket, assembly and methods 5 1999
6,232,146 Semiconductor device including combed bond pad opening, assemblies and methods 2 1999
6,258,623 Low profile multi-IC chip package connector 148 1999
6,417,024 Back-to-back semiconductor device module, assemblies including the same and methods 6 1999
6,268,655 Semiconductor device including edge bond pads and methods 13 1999
6,445,063 Method of forming a stack of packaged memory die and resulting apparatus 12 1999
6,198,636 Semiconductor device socket, assembly and methods 2 1999
6,144,560 Semiconductor device including combed bond pad opening, assemblies and methods 13 1999
6,453,550 Method for forming modular sockets using flexible interconnects and resulting structures 16 2000
6,319,065 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures 13 2000
6,218,216 Transverse hybrid LOC package 4 2000
6,259,153 Transverse hybrid LOC package 100 2000
6,225,689 Low profile multi-IC chip package connector 109 2000
6,329,221 Method of forming a stack of packaged memory die and resulting apparatus 7 2000
6,380,630 Vertical surface mount package utilizing a back-to-back semiconductor device module 12 2000
6,295,209 Semiconductor device including combed bond pad opening, assemblies and methods 9 2000
6,410,406 Semiconductor device including edge bond pads and methods 10 2000
6,442,044 Semiconductor device socket, assembly and methods 3 2000
6,475,831 Methods for a low profile multi-IC chip package connector 5 2001
6,476,468 Transverse hybrid LOC package 5 2001
6,406,943 Transverse hybrid LOC package 3 2001
6,458,625 Multi chip semiconductor package and method of construction 13 2001
6,362,519 Low profile multi-IC chip package connector 3 2001
6,445,061 Leads under chip in conventional IC package 6 2001
6,414,374 Semiconductor device including edge bond pads and methods 28 2001
6,478,627 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures 9 2001
6,830,961 Methods for leads under chip in conventional IC package 2 2001
6,465,275 Method of forming a stack of packaged memory die and resulting apparatus 8 2001
6,803,656 Semiconductor device including combed bond pad opening 5 2001
6,518,098 IC package with dual heat spreaders 15 2001
6,486,546 Low profile multi-IC chip package connector 13 2002
6,507,109 Vertical surface mount package utilizing a back-to-back semiconductor device module 6 2002
6,531,342 Method for transverse hybrid loc package 1 2002
6,677,671 Apparatus for forming a stack of packaged memory dice 0 2002
6,828,173 Semiconductor device including edge bond pads and methods 3 2002
6,825,547 Semiconductor device including edge bond pads 5 2002
6,835,592 Methods for molding a semiconductor die package with enhanced thermal conductivity 5 2002
6,656,767 Method of forming a stack of packaged memory dice 11 2002
7,015,063 Methods of utilizing a back to back semiconductor device module 2 2002
6,612,872 Apparatus for forming modular sockets using flexible interconnects and resulting structures 4 2002
6,537,100 Apparatus and method for packaging circuits 0 2002
6,773,955 Low profile multi-IC chip package connector 6 2002
6,765,803 Semiconductor device socket 2 2002
6,686,655 Low profile multi-IC chip package connector 5 2002
6,760,970 Method for forming modular sockets using flexible interconnects and resulting structures 2 2002
6,673,650 Multi chip semiconductor package and method of construction 1 2002
6,765,291 IC package with dual heat spreaders 2 2002
6,751,859 Method for forming modular sockets using flexible interconnects and resulting structures 7 2002
6,753,598 Transverse hybrid LOC package 1 2002
6,920,688 Method for a semiconductor assembly having a semiconductor die with dual heat spreaders 2 2002
6,800,505 Semiconductor device including edge bond pads and related methods 3 2002
6,958,528 Leads under chip IC package 3 2002
6,873,037 Vertical surface mount package utilizing a back-to-back semiconductor device module 3 2003
6,835,604 Methods for transverse hybrid LOC package 1 2003
7,153,164 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures 0 2003
7,094,108 Apparatus for forming modular sockets using flexible interconnects and resulting structures 1 2003
6,758,696 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures 3 2003
6,897,553 Apparatus for forming a stack of packaged memory dice 8 2003
6,884,654 Method of forming a stack of packaged memory dice 2 2003
7,282,789 Back-to-back semiconductor device assemblies 3 2004
7,057,291 Methods for securing vertically mountable semiconductor devices in back-to back relation 0 2004
7,040,930 Modular sockets using flexible interconnects 1 2005
7,091,061 Method of forming a stack of packaged memory dice 4 2005
7,084,490 Leads under chip IC package 2 2005
7,192,311 Apparatus for forming modular sockets using flexible interconnects and resulting structures 0 2005
7,642,643 Apparatus for molding a semiconductor die package with enhanced thermal conductivity 2 2005
7,367,845 Modular sockets using flexible interconnects 1 2006
 
ROUND ROCK RESEARCH, LLC (20)
6,342,731 Vertically mountable semiconductor device, assembly, and methods 10 1997
6,140,696 Vertically mountable semiconductor device and methods 7 1998
6,087,723 Vertical surface mount assembly and methods 11 1998
6,634,098 Methods for assembling, modifying and manufacturing a vertical surface mount package 1 1999
6,239,012 Vertically mountable semiconductor device and methods 24 1999
6,265,773 Vertically mountable and alignable semiconductor device, assembly, and methods 15 1999
6,800,942 Vertically mountable semiconductor device and methods 3 1999
6,228,677 Vertical surface mount assembly and methods 9 2000
6,215,183 Vertical surface mount assembly and methods 6 2000
6,611,058 Vertical surface mount assembly and methods 2 2001
6,455,351 Vertical surface mount assembly and methods 5 2001
6,383,839 Vertically mountable semiconductor device and methods 5 2001
6,492,728 Vertical surface mount assembly 3 2001
6,512,290 Vertically mountable and alignable semiconductor device, assembly, and methods 7 2001
6,531,764 Vertically mountable semiconductor device, assembly, and methods 5 2001
7,871,859 Vertical surface mount assembly and methods 0 2002
6,963,128 Vertically mountable and alignable semiconductor device assembly 0 2003
7,082,681 Methods for modifying a vertical surface mount package 0 2003
7,227,261 Vertical surface mount assembly and methods 0 2003
7,569,418 Methods for securing packaged semiconductor devices to carrier substrates 0 2005
 
RENESAS ELECTRONICS CORPORATION (3)
6,479,327 Semiconductor device and method for manufacturing the same 11 2001
7,138,673 Semiconductor package having encapsulated chip attached to a mounting plate 4 2003
7,449,370 Production process for manufacturing such semiconductor package 1 2006
 
ALPINE MICROSYSTEMS, INC. (1)
6,175,161 System and method for packaging integrated circuits 41 1998
 
FUJI XEROX CO., LTD. (1)
7,260,284 Semiconductor integrated circuit and semiconductor integrated circuit arrangement device and process 0 2005
 
NIPPON STEEL SEMICONDUCTOR CORPORATION (1)
6,118,173 Lead frame and a semiconductor device 3 1997
 
TECHNOLOGY IP HOLDINGS (1)
6,128,201 Three dimensional mounting assembly for integrated circuits 18 1998
 
TEXAS INSTRUMENTS INCORPORATED (1)
7,808,088 Semiconductor device with improved high current performance 0 2007
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (2)
8,440,554 Through via connected backside embedded circuit features structure and method 0 2010
8,441,110 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 0 2011