Semiconductor device and module
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United States of America Patent
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-
Jan 7, 1997
Grant Date -
N/A
app pub date -
Apr 4, 1995
filing date -
Apr 19, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device in a vertical surface mount package, reduced in size and having a higher heat radiating capacity, a method of producing the semiconductor device, and a semiconductor module. Leads of a first lead frame and leads of a second lead frame are parallel to each other and at least a portion of the leads overlap leads of the other lead frame when geometrically projected on them. An inner lead may extend out from the semiconductor package or the back side of a die pad in the semiconductor package may be exposed. The invention allows more outer leads to be used and makes it possible to reduce the size of the semiconductor device and to achieve high density mounting.
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