Semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO

5592023

SERIAL NO

08494538

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor device which comprises a first insulator, a first conductor disposed on one side near a semiconductor substrate, a second conductor disposed on the opposite side to the substrate forming a tubular member together with the first conductor, and a second insulator surrounding the member. The first insulator is incorporated into the member, and the member and the first insulator constitute an electrical wiring. Since the wiring is composed of the first insulator and the first and second conductors surrounding the first insulator, an electric current flows the tubular member of the conductors. Therefore, when the device is operated by a high-frequency (for example 80 GHz or more) electric current, apparent increase of the wiring resistance due to the 'skin effect' hardly occur and as a result, reduction of the operating speed can be prevented.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NEC ELECTRONICS CORPORATIONKAWASAKI-SHI KANAGAWA196

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Oda, Noriaki Tokyo, JP 59 514

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 4776087 VLSI coaxial wiring structure 50 1987
 
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (1)
* 4581291 Microminiature coaxial cable and methods manufacture 23 1983
 
FUJITSU LIMITED (1)
* 4833519 Semiconductor device with a wiring layer having good step coverage for contact holes 41 1987
 
NEC ELECTRONICS CORPORATION (1)
* 5479053 Semiconductor device with conductor clad insulator wiring 14 1993
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
ADVANCED MICRO DEVICES, INC. (1)
* 6147404 Dual barrier and conductor deposition in a dual damascene process for semiconductors 12 1999
 
Rosenberger Hochfrequenztechnick GmbH & Co. KG (1)
8839508 Method of making a high frequency device package 0 2011
 
INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES (2)
* 8513742 Method for manufacturing contact and semiconductor device having said contact 0 2011
* 2012/0223,398 METHOD FOR MANUFACTURING CONTACT AND SEMICONDUCTOR DEVICE HAVING SAID CONTACT 1 2011
 
ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG (6)
6770822 High frequency device packages and methods 73 2002
* 2003/0159,262 High frequency device packages and methods 4 2002
7520054 Process of manufacturing high frequency device packages 2 2002
* 2003/0168,250 High frequency device packages and methods 6 2002
8581113 Low cost high frequency device package and methods 0 2007
9275961 Low cost high frequency device package and methods 0 2012
 
REMEC BROADBAND WIRELESS HOLDINGS, INC. (1)
6667549 Micro circuits with a sculpted ground plane 7 2002
* Cited By Examiner