Inspection system for cross-sectional imaging
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United States of America Patent
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Jan 7, 1997
Grant Date -
N/A
app pub date -
Sep 2, 1994
filing date -
Jan 19, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus for inspecting a bonded joint between components. A cross-sectional image of the joint is analyzed by determining the location of a first characteristic of the joint, the centroid of the joint in the cross-sectional image; and then measuring a second characteristic of the joint in reference to the location of the centroid. This measurement may be used by comparing it with a predetermined specification expected for the measurement for the purpose of determining the quality of the joint. The invention is particularly advantageous for studying cross-sectional X-ray images of solder joints between electronic components and substrata upon which they are mounted and can be implemented for analyzing the images produced in cross-sectional X-ray inspection machines such as scanned beam X-ray laminography systems or digital tomosynthesis systems.
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