Method of cleaning solder pastes from a substrate with an aqueous cleaner
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United States of America Patent
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Jan 14, 1997
Grant Date -
N/A
app pub date -
Apr 26, 1995
filing date -
Apr 26, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Printing applicators such as metal stencils and screens used to apply solder paste to printed circuit boards are cleaned to remove accumulated solder paste therefrom by an aqueous alkaline salt cleaner. The aqueous cleaner of the present invention comprises alkaline salts such as alkali metal carbonates, a surfactant formulation which contains at least one nonionic surfactant, an alkali metal silicate corrosion inhibitor and stabilizers to maintain the components in aqueous solution. The cleaner of the present invention contains no VOCs and is an effective and safe replacement for alcohol solvents previously used to clean solder paste from screens and stencils.
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