Method of patterned metallization of substrate surfaces
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United States of America Patent
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Jan 14, 1997
Grant Date -
N/A
app pub date -
Feb 14, 1996
filing date -
Feb 14, 1995
priority date (Note) -
Expired
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Abstract
A method for patterned metallization of substrate surfaces, especially circuit boards, even three-dimensional ones, by using electromagnetic UV radiation, particularly from an excimer laser. In the method a primer layer is applied to the full substrate surface in the area of a metal layer that is subsequently applied; insulating channels then are made in the primer layer by complete removal of the primer in certain areas by the action of electromagnetic radiation in the UV range; and afterward the remaining patterned primer layer is provided with the metal layer to form conductor strips. The method makes it possible to create insulating channels with extremely sharp contours in the primer layer on the surface of even three-dimensional, electronic circuit media.
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