Apparatus and method for depositing charge on a semiconductor wafer
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United States of America Patent
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-
Jan 14, 1997
Grant Date -
N/A
app pub date -
Jul 7, 1995
filing date -
Jul 7, 1995
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A conductive screen is placed between a corona gun and the surface of a semiconductor wafer. The charge deposited on the wafer by the gun is controlled by a potential applied to the screen. A chuck orients the wafer in close proximity to the screen. A desired charge is applied to the wafer by first applying a surplus of one charge to the wafer and then depositing an opposite polarity charge until the potential of the wafer equals the potential of the screen.
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