Radio frequency probe and probe card including a signal needle and grounding needle coupled to a microstrip transmission line
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United States of America Patent
Stats
-
Jan 14, 1997
Grant Date -
N/A
app pub date -
Sep 1, 1994
filing date -
Sep 2, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The radio frequency probe for measuring radio frequency characteristics of a semiconductor device includes: an insulating substrate having a front surface, a back surface, and a side bottom face; a microstrip transmission line including a signal line made of conductive material formed on the front surface of the insulating substrate and a grounding electrode made of conductive material formed on the substantially entire portion of the back surface of the insulating substrate; and a signal needle and a grounding needle electrically connected to the signal line and the grounding electrode, respectively, the signal needle and the grounding needle being close to each other and being disposed so that the distances from the side bottom face to the top ends of the needles are substantially equal to each other so as to allow the signal needle and the grounding needle to contact a signal electrode pad and a grounding electrode pad of the semiconductor device simultaneously. A probe card having the radio frequency probe is also provided.
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