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Abstract

A method for forming a conductor circuit is provided which comprises depositing and filling a conductor metal in recessions of insulator in the form of grooves or holes using an electroless plating solution, the conductor metal being deposited and filled in the recession to the same level as the surface of the insulator, wherein said electroless plating solution contains an inhibitor which inhibits the cathodic partial reaction which is a metal deposition reaction and the electroless plating is carried out with stirring the plating solution. Since the plating reaction automatically stops when the metal conductor 1 is formed up to the level of the surface of the insulator 2, a conductor circuit in which the surface of the metal conductor 1 and that of the insulator 2 are even and at the same level can be easily obtained. Furthermore, since the conductor circuits differing in thickness can be simultaneously formed on one substrate, the number of lamination in making multilayer circuit can be reduced and a multilayer circuit board of low electric resistance can be obtained.

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First Claim