Manufacture of micro electron emitter
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United States of America Patent
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Feb 4, 1997
Grant Date -
N/A
app pub date -
Oct 18, 1995
filing date -
Oct 21, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing an electric field emission type device. A recess having a tapered surface at an upper portion of the recess is provided. A sacrificial film is deposited on the substrate with the tapered recess. A sharp cusp is therefore formed on the surface of the sacrificial film over the recess. An electron emitting material film is deposited on the sacrificial film to form a fine emitter with a sharp tip. This fine emitter is exposed by etching and removing unnecessary regions under the fine emitter. This manufacturing method realizes a high performance electric field emission type device having an emitter tip with a small radius of curvature and a small apex angle.
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