Importance

Loading Importance Indicators...

Abstract

An integral solder preform is disclosed for application to a printed circuit card having first and second sides, a first edge and first and second pluralities of conductive pads disposed on the respective first and second sides of the printed circuit card in respective first and second predetermined conductive pad arrangements. The integral solder preform has first and second pluralites of solder pads having respective first and second solder pad arrangements which are maintained in position by a plurality of bridging solder bands. The first and second solder pad arrangements correspond to the first and second predetermined conductive pad arrangements and are spaced apart by a predetermined distance by spacing solder bands. The printed circuit card is aligned over the spacing solder bands and the first and second solder pad arrangements are wrapped around the first edge such that the first and second solder pad pluralities of solder pads overlay respective first and second pluralities of conductive pads on the printed circuit card. A fixture which may be employed to facilitate the alignment of the solder preform for use with the solder preform is also disclosed.

Loading the Abstract Image...

First Claim