Semiconductor package having interdigitated leads
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United States of America Patent
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-
Feb 4, 1997
Issued Date -
N/A
app pub date -
Jun 7, 1995
filing date -
Oct 8, 1993
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The invention discloses a semiconductor package having two rows of interdigitated leads. The two rows of leads (14, 16) are affixed on and extend from one side of the semiconductor package (10). The two rows of leads (14, 16) are interdigitated with each other in a non-contacting manner. The end portions of the leads (17) are further shaped to form a contact surface for soldering to electrical conductors on a printed circuit board.
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