Hermetically sealed high density multi-chip package
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United States of America Patent
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Feb 4, 1997
Grant Date -
N/A
app pub date -
May 24, 1995
filing date -
May 24, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An on-board chip package has a hermetically sealed connector mechanically secured to a printed wiring board and electrically connected to input/output pads on the board. Chip dies are mechanically bonded to the board and then individually encapsulated with a suitable potting material. The entire assembly is coated with an encapsulating polymer, which partially overlaps the inboard side of the hermetic connector housing and which provides a relatively smooth, crevice-free outer surface. The entire assembly is then covered, in the preferred embodiment, with a metal layer, to hermetically seal the entire chip-on-board assembly.
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