Paddleless molded plastic semiconductor chip package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 18, 1997
Grant Date -
N/A
app pub date -
Jun 30, 1994
filing date -
Jun 30, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a semiconductor package and method in which a semiconductor chip is mounted within the opening of a lead frame by bonding wires extending between the active front side of the chip and bonding pads of the lead frame, and the lead frame/chip assembly is encased. within a plastic molded body, with the inactive back side of the chip exposed and facing outside the package.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully