Low temperature co-fired ceramic substrates for power converters
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United States of America Patent
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Feb 18, 1997
Grant Date -
N/A
app pub date -
Jun 7, 1995
filing date -
Jun 7, 1995
priority date (Note) -
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Abstract
Electronic power conversion circuitry, for frequencies not exceeding 30 MHz, is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semiconductor devices into the body of the low temperature co-fired ceramic structure, such as resistors, capacitors, inductors and transformers. Use of a low temperature co-fired ceramic structure as a substrate on and within which power conversion circuitry is formed allows selection of various conductive and resistive inks to precisely form interconnection circuitry and selected non-semiconductor components which improves the stability and reduces the cost of power conversion circuits.
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