Importance

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Abstract

An ultrasonic bonder for coupling lead frame leads to associated traces on a substrate is disclosed. In one aspect of the invention, the bonder includes an ultrasonic transducer. A base supports the transducer at one end, while a bonding tool is attached to the other end. The bonding tool is suitably sized for engaging a lead frame lead to facilitate connecting the lead frame lead to an associated trace on a substrate. A pair of force sensors are positioned on opposite sides of the transducer's longitudinal axis. Each force sensor has a sensor axis that is arranged at an acute angle relative to the longitudinal axis of the transducer for detecting the forces applied to the bonding tool and for outputting a force signal indicative of the detected forces. A controller receives the force signals and outputs a drive signal to the transducer to facilitate mechanically bonding the selected lead frame lead to its associated trace. The bonding tool being secured to the bonding tool end of the transducer such that actuation of the transducer will cause movement of the bonding tool. The outputted drive signal is controlled at least in part on the basis of the received force signals. An ultrasonic bonder for coupling an integrated circuit die to associated wiring traces is also disclosed. Additionally, methods of ultrasonic bonding and packaging of semiconductor devices using the described bonder are disclosed.

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First Claim