Solder bump transfer device for flip chip integrated circuit devices
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United States of America Patent
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-
Mar 4, 1997
Grant Date -
N/A
app pub date -
Apr 24, 1995
filing date -
Apr 24, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
A carrier device (10) is provided for transferring solder bumps (16) to a surface of a flip chip integrated circuit device (18). The carrier device (10) is equipped with cavities (12) on its surface for receiving and retaining solder material (14), by which the solder material (14) can be transferred to the flip chip (18) as molten solder bumps (16). The cavities (12) are located on the surface of the carrier device (10) such that the location of the solder material (14) will correspond to the desired solder bump locations on the flip chip (18) when the carrier device (10) is registered with the flip chip (18). The size of the cavities (12) can be controlled in order to deliver a precise quantity of solder material (14) to the flip chip (18).
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