Leadframe having contact pads defined by a polymer insulating film
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United States of America Patent
Stats
-
Mar 4, 1997
Grant Date -
N/A
app pub date -
Dec 30, 1994
filing date -
Dec 30, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided. Pads on a chip are wire bonded to these contact pads on the leadframe. The first portion is encapsulated in a molded package. The structure inhibits silver migration, provides insulation between wires and leadframe, and provides improved adhesion between plastic package and leadframe. A single insulating film with openings for providing the contact pads provides all these features.
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