Molded plastic semiconductor package including heat spreader
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United States of America Patent
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-
Mar 4, 1997
Issued Date -
N/A
app pub date -
Jul 18, 1994
filing date -
Sep 17, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery is approached.
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