Wafer having adhesive skin barrier layer
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United States of America Patent
Stats
-
Mar 11, 1997
Grant Date -
N/A
app pub date -
Aug 1, 1995
filing date -
Aug 1, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An adhesive wafer is disclosed having a thin barrier layer of soft, pliant adhesive material with particles of one or more hydrocolloids dispersed therein. A flexible and preferably stretchable cover layer extends along one side of the barrier layer and a removable release sheet protects the opposite side of the barrier layer. The wafer has a central zone and a relatively large outer zone surrounding that central zone, with the material of the barrier layer in the outer zone having generally uniform molecular orientations in radial directions over an arc of 360 degrees and being of relatively uniform tensile strength in all such radial directions. Also disclosed are injection/compression molding methods for making such wafers.
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