Substrate heat treatment apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5611685
SERIAL NO

08450758

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate heat treatment apparatus includes a heat treatment furnace of a flat configuration, and having a cavity in which a substrate is accommodated. The heat treatment furnace includes a gas supply unit at one side end face, an opening for communication between the cavity and the outside world, and a gas discharge unit in the vicinity of the opening for discharging gas from the cavity at the other side end face. The heat treatment furnace further includes a cover for shutting the opening allowing opening/closing thereof. In the gas exhaust unit, an exhaust chamber is formed on the other side end face along the opening with a partition wall between the opening and the exhaust chamber. An exhaust portion is formed in communication with the outside world in the exhaust chamber. The partition wall is formed so that the edge of the partition wall is displaced away from the inside surface of the cover, whereby a slit-like vent passage extending in the direction of the width of the cavity is formed between the cover and the edge of the partition wall when the opening is shut. The gas flow is uniform in the vicinity of the vent passage when a substrate is loaded/unloaded into and/from the heat treatment furnace, and also during heat treatment. The outside air will not enter the furnace, and no stagnation of the process gas occurs in the furnace.

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Patent Owner(s)

Patent OwnerAddress
DAINIPPON SCREEN MFG CO LTDKYOTO JAPAN KYOTO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiba, Takatoshi Kyoto, JP 25 966
Nakajima, Toshihiro Kyoto, JP 68 328
Nishii, Kiyofumi Kyoto, JP 3 553
Sato, Toru Kyoto, JP 99 1777

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