Self-opening vent hole in an overmolded semiconductor device
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United States of America Patent
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-
Mar 18, 1997
Grant Date -
N/A
app pub date -
Oct 13, 1992
filing date -
Oct 13, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A self-opening vent hole semiconductor device (10) can be manufactured to reduce the risk of popcorning during solder reflow. The device contains a semiconductor die (22) mounted on a die mounting area (15) of a substrate (12). A venting hole (16) is approximately centrally located in the die mounting area. A venting hole sealing cap (20) covers and seals the venting hole. A layer of patterned solder resist (18) adheres to a lower surface of the substrate. The venting hole sealing cap can be made from the layer of solder resist, and can be configured to be either physically isolated from the solder resist layer or physically partially connected to the solder resist layer. The venting hole sealing cap is designed to be a weakest interface within the device so that it self-opens upon an internal pressure less than a destructive pressure to the device. Solder balls (30) provide external electrical connections for the device.
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