Orthopaedic instrumentation assembly having an offset bushing
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United States of America Patent
Stats
-
Mar 25, 1997
Grant Date -
N/A
app pub date -
Jul 6, 1995
filing date -
Jul 6, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention is directed to an orthopaedic instrumentation assembly 10 located relative to an intramedullary member 12, wherein the intramedullary member is disposed at least partially within a bone. The instrumentation assembly 10 includes an offset bushing 16 having a longitudinal axis and a bore therethrough for receiving the intramedullary member. The bore is disposed non-coaxially relative to the longitudinal axis. A sizing plate 14 has an opening 22 therein, and further includes a portion associated with the opening for receiving the bushing, wherein the bushing is rotatably supported. Upon movement of the bushing 16 or sizing plate 14, the bushing and sizing plate coact to position the sizing plate relative to each of the intramedullary member and the bone.
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