US Patent No: 5,614,114

Number of patents in Portfolio can not be more than 2000

Laser system and method for plating vias

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ATTORNEY / AGENT: (SPONSORED)
 

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Abstract

The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for plating internal wall surfaces (79, 126) of vias (72, 74) in multilayered electronic devices (80). The parameters of the output pulses (62) are selected to facilitate substantially uniform deposition of plating material particles explosively vaporized from a substrate (124) onto the internal wall surface (79, 126). These parameters typically include at least two of the following criteria: high average power of greater than about 100 milliwatts measured over the beam spot area, a temporal pulse width shorter than about 100 nanoseconds, a spot diameter of less than about 50 microns, and a repetition rate of greater than about one kilohertz.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ELECTRO SCIENTIFIC INDUSTRIES, INC.PORTLAND, OR279

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Owen, Mark D Beaverton, OR 30 531

Cited Art

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
5,153,408 Method and structure for repairing electrical lines 21 1990
5,093,279 Laser ablation damascene process 63 1991
5,194,713 Removal of excimer laser debris using carbon dioxide laser 23 1991
 
CANON KABUSHIKI KAISHA (2)
5,073,687 Method and apparatus for working print board by laser 41 1990
5,063,280 Method and apparatus for forming holes into printed circuit board 52 1990
 
MICRON TECHNOLOGY, INC. (2)
5,124,780 Conductive contact plug and a method of forming a conductive contact plug in an integrated circuit using laser planarization 87 1991
5,073,518 Process to mechanically and plastically deform solid ductile metal to fill contacts of conductive channels with ductile metal and process for dry polishing excess metal from a semiconductor wafer 16 1991
 
UNISYS CORPORATION (2)
4,832,788 Method of fabricating a tapered via hole in polyimide 32 1987
5,087,396 Method of forming holes in unfired ceramic layers of integrated circuit packages 16 1991
 
CIRQON TECHNOLOGIES CORPORATION (1)
5,340,947 Ceramic substrates with highly conductive metal vias 41 1992
 
DEUTSCHE FORSCHUNGSANSTALT FUR LUFT-UND RAUMFAHRT E.V. (1)
5,492,861 Process for applying structured layers using laser transfer 35 1993
 
HITACHI, LTD. (1)
4,659,587 Electroless plating process and process for producing multilayer wiring board 27 1985
 
INTERSIL CORPORATION (1)
4,628,174 Forming electrical conductors in long microdiameter holes 19 1984
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
5,034,569 Multilayer interconnection circuit board 6 1990
 
TEIJIN LIMITED (1)
5,378,869 Method for forming an integrated circuit package with via interconnection 29 1993
 
VISICOM MANUFACTURING CORPORATION (1)
5,108,785 Via formation method for multilayer interconnect board 46 1989
 
WORLD PROPERTIES, INC. (1)
4,915,981 Method of laser drilling fluoropolymer materials 73 1988
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (1)
5,060,595 Via filling by selective laser chemical vapor deposition 23 1990

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
BRIDGE SEMICONDUCTOR CORPORATION (47)
6,537,851 Method of connecting a bumped compliant conductive trace to a semiconductor chip 3 2001
6,673,710 Method of connecting a conductive trace and an insulative base to a semiconductor chip 6 2001
6,667,229 Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip 3 2001
6,492,252 Method of connecting a bumped conductive trace to a semiconductor chip 20 2001
6,800,506 Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly 4 2002
6,583,040 Method of making a pillar in a laminated structure for a semiconductor chip assembly 8 2002
6,740,576 Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly 46 2002
6,608,374 Semiconductor chip assembly with bumped conductive trace 5 2002
7,264,991 Method of connecting a conductive trace to a semiconductor chip using conductive adhesive 5 2002
6,699,780 Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching 6 2002
6,809,414 Semiconductor chip assembly with bumped conductive trace 5 2002
6,984,576 Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip 2 2003
6,949,408 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps 2 2003
6,908,788 Method of connecting a conductive trace to a semiconductor chip using a metal base 2 2003
6,872,591 Method of making a semiconductor chip assembly with a conductive trace and a substrate 8 2003
6,876,072 Semiconductor chip assembly with chip in substrate cavity 14 2003
7,190,080 Semiconductor chip assembly with embedded metal pillar 14 2003
7,094,676 Semiconductor chip assembly with embedded metal pillar 8 2003
7,009,297 Semiconductor chip assembly with embedded metal particle 13 2004
7,015,128 Method of making a semiconductor chip assembly with an embedded metal particle 9 2004
7,067,911 Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture 13 2004
7,129,113 Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture 11 2004
7,071,573 Semiconductor chip assembly with welded metal pillar 5 2004
7,132,741 Semiconductor chip assembly with carved bumped terminal 19 2004
7,129,575 Semiconductor chip assembly with bumped metal pillar 5 2004
7,112,521 Method of making a semiconductor chip assembly with a bumped metal pillar 2 2004
7,071,089 Method of making a semiconductor chip assembly with a carved bumped terminal 4 2004
7,319,265 Semiconductor chip assembly with precision-formed metal pillar 4 2005
7,075,186 Semiconductor chip assembly with interlocked contact terminal 5 2005
7,232,706 Method of making a semiconductor chip assembly with a precision-formed metal pillar 3 2005
7,232,707 Method of making a semiconductor chip assembly with an interlocked contact terminal 3 2005
7,414,319 Semiconductor chip assembly with metal containment wall and solder terminal 2 2005
7,419,851 Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal 2 2005
7,268,421 Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond 2 2006
7,262,082 Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture 44 2006
7,993,983 Method of making a semiconductor chip assembly with chip and encapsulant grinding 1 2006
7,750,483 Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal 0 2006
7,446,419 Semiconductor chip assembly with welded metal pillar of stacked metal balls 1 2006
7,425,759 Semiconductor chip assembly with bumped terminal and filler 2 2006
7,396,703 Method of making a semiconductor chip assembly with a bumped terminal and a filler 2 2006
7,932,165 Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base 0 2006
7,453,140 Semiconductor chip assembly with laterally aligned filler and insulative base 1 2006
7,417,314 Semiconductor chip assembly with laterally aligned bumped terminal and filler 3 2006
7,494,843 Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding 0 2006
7,538,415 Semiconductor chip assembly with bumped terminal, filler and insulative base 1 2007
7,833,827 Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base 1 2007
7,811,863 Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment 0 2009
 
ORBOTECH LTD. (9)
6,689,985 Laser drill for use in electrical circuit fabrication 19 2001
7,642,484 Multiple beam micro-machining system and method 1 2002
7,633,036 Micro-machining system employing a two stage beam steering mechanism 1 2002
7,176,409 Multiple beam micromachining system for removing at least two different layers of a substrate 2 2002
6,809,290 Laser energy delivery system outputting beams having a selectable energy 5 2002
7,629,555 Multiple beam micro-machining system and method 0 2003
7,521,651 Multiple beam micro-machining system and method 0 2003
7,078,650 Micro-machining employing multiple independently focused and independently steered beams 3 2003
7,947,922 Multiple beam micro-machining system and method 0 2009
 
UNIVERSITY OF TENNESSEE RESEARCH FOUNDATION (9)
6,294,225 Method for improving the wear and corrosion resistance of material transport trailer surfaces 3 1999
6,173,886 Method for joining dissimilar metals or alloys 3 1999
6,497,985 Method for marking steel and aluminum alloys 1 1999
6,423,162 Method for producing decorative appearing bumper surfaces 1 1999
6,284,067 Method for producing alloyed bands or strips on pistons for internal combustion engines 18 1999
6,328,026 Method for increasing wear resistance in an engine cylinder bore and improved automotive engine 7 1999
6,229,111 Method for laser/plasma surface alloying 7 1999
6,350,326 Method for practicing a feedback controlled laser induced surface modification 27 1999
6,660,962 Method for gas assisted energy beam engraving of a target object 1 2002
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (7)
8,048,774 Methods and systems for laser machining a substrate 0 2002
RE43400 Laser segmented cutting, multi-step cutting, or both 0 2006
7,544,304 Process and system for quality management and analysis of via drilling 1 2006
7,886,437 Process for forming an isolated electrically conductive contact through a metal package 3 2007
7,943,862 Method and apparatus for optically transparent via filling 0 2008
RE43487 Laser segmented cutting 0 2009
RE43605 Laser segmented cutting, multi-step cutting, or both 0 2009
 
HITACHI VIA MECHANICS, LTD. (4)
6,310,701 Method and apparatus for ablating high-density array of vias or indentation in surface of object 9 2000
6,420,675 Control system for ablating high-density array of vias or indentation in surface of object 11 2000
6,256,121 Apparatus for ablating high-density array of vias or indentation in surface of object 36 2000
6,653,593 Control system for ablating high-density array of vias or indentation in surface of object 5 2002
 
INDENTIFICATION DYNAMICS, LLC (4)
6,886,284 Firearm microstamping and micromarking insert for stamping a firearm identification code and serial number into cartridge shell casings and projectiles 6 2002
6,833,911 Method and apparatus for reading firearm microstamping 3 2003
7,111,423 Method and apparatus for reading firearm microstamping 0 2003
7,204,419 Method and apparatus for reading firearm microstamping 6 2003
 
SEAGATE TECHNOLOGY LLC (4)
5,968,608 Laser texturing of magnetic recording medium using multiple lens focusing 2 1996
5,955,154 Magnetic recording medium with laser textured glass or glass-ceramic substrate 7 1996
6,020,045 Textured magnetic recording medium having a transition zone 21 1996
6,093,472 Magnetic recording medium with laser textured glass or glass-ceramic substrate 2 1999
 
3M INNOVATIVE PROPERTIES COMPANY (3)
6,403,211 Liquid crystal polymer for flexible circuits 14 2000
6,923,919 Liquid crystal polymers for flexible circuits 1 2001
6,696,163 Liquid crystal polymers for flexible circuits 10 2002
 
GENERAL ELECTRIC COMPANY (2)
5,773,790 Beam blocking material and method for beam drilling and inspecting cooling holes 16 1997
6,339,208 Method of forming cooling holes 6 2000
 
LIN, CHARLES W.C. (2)
6,437,452 Bumpless flip chip assembly with strips-in-via and plating 2 1999
6,316,830 Bumpless flip chip assembly with strips and via-fill 14 1999
 
NEC ELECTRONICS CORPORATION (2)
5,900,645 Semiconductor device and method of testing the same 44 1997
6,159,756 Method of testing semiconductor device 3 1999
 
AEROSPACE CORPORATION, THE (1)
5,858,478 Magnetic field pulsed laser deposition of thin films 5 1997
 
AMO MANUFACTURING USA, LLC (1)
6,090,102 Short pulse mid-infrared laser source for surgery 46 1997
 
CHARLES W.C. LIN. (1)
6,448,644 Flip chip assembly with via interconnection 18 1998
 
EFFICERE, LLC (1)
6,878,901 Laser micromachining and electrical structures formed thereby 2 2004
 
ELECTRO SCIEITIFIC INDUSTRIES, INC. (1)
8,117,744 Process for forming an isolated electrically conductive contact through a metal package 0 2011
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
6,509,546 Laser excision of laminate chip carriers 19 2000
 
LOCKHEED MARTIN CORPORATION (1)
6,541,731 Use of multiple laser sources for rapid, flexible machining and production of vias in multi-layered substrates 68 2001
 
MARGER JOHNSON & MCCOLLOM, P.C. (1)
7,062,845 Conveyorized blind microvia laser drilling system 4 2003
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
7,097,394 Circuit board production method and circuit board production data 0 2001
 
MICROSOUND SYSTEMS, INC. (1)
6,266,857 Method of producing a backing structure for an ultrasound transceiver 7 1998
 
MITSUBISHI ELECTRIC & ELECTRONICS USA, INC. (1)
6,576,493 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps 12 2002
 
NIPPON MEKTRON, LTD. (1)
6,523,257 Method for forming fine through hole conduction portion of circuit board 0 2001
 
ORBTECH LTD. (1)
7,206,120 Dynamic beam splitter outputting a selectable number of beams 7 2003
 
SPINESMITH PARTNERS, L.P. (1)
7,459,385 Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler 2 2006
 
TENNESSEE, UNIVERSITY OF, RESEARCH CORPORATION, THE (1)
6,299,707 Method for increasing the wear resistance in an aluminum cylinder bore 2 1999
 
TESSERA, INC. (1)
6,675,469 Vapor phase connection techniques 6 2000
 
THE HONG KONG POLYTECHNIC UNIVERSITY (1)
6,809,289 Method of drilling a circuit board 1 2003
 
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (1)
5,932,119 Laser marking system 47 1996
 
U.S. PHILIPS CORPORATION (1)
5,935,294 Method of manufacturing and transferring metallic droplets 1 1997
 
W. L. GORE & ASSOCIATES, INC. (1)
5,973,290 Laser apparatus having improved via processing rate 17 1997
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (25)
6,562,657 Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint 9 2000
6,551,861 Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive 7 2000
6,402,970 Method of making a support circuit for a semiconductor chip assembly 10 2000
6,350,633 Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint 23 2000
6,350,386 Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly 13 2000
6,350,632 Semiconductor chip assembly with ball bond connection joint 9 2000
6,448,108 Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment 12 2000
6,440,835 Method of connecting a conductive trace to a semiconductor chip 20 2000
6,444,489 Semiconductor chip assembly with bumped molded substrate 16 2000
6,653,170 Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit 32 2001
6,528,891 Bumpless flip chip assembly with solder via 17 2001
6,475,833 Bumpless flip chip assembly with strips and via-fill 5 2001
6,406,939 Flip chip assembly with via interconnection 16 2001
6,403,400 Bumpless flip chip assembly with strips-in-via and plating 7 2001
6,660,626 Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint 13 2001
6,562,709 Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint 26 2001
6,511,865 Method for forming a ball bond connection joint on a conductive trace and conductive pad in a semiconductor chip assembly 6 2001
6,653,217 Method of connecting a conductive trace to a semiconductor chip 17 2001
6,544,813 Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment 5 2001
6,436,734 Method of making a support circuit for a semiconductor chip assembly 6 2001
6,403,460 Method of making a semiconductor chip assembly 9 2001
6,548,393 Semiconductor chip assembly with hardened connection joint 5 2001
6,576,539 Semiconductor chip assembly with interlocked conductive trace 21 2001
6,627,824 Support circuit with a tapered through-hole for a semiconductor chip assembly 9 2001
6,653,742 Semiconductor chip assembly with interlocked conductive trace 4 2002